零件MSD標(biāo)準(zhǔn)ppt課件

CelesticaAsia GenericIntroduction MoistureSensitiveDevice MSD ProcessControlPurpose空氣中的水分會(huì)通過滲透進(jìn)入一般性包裝材料 利用表面裝貼技術(shù)將SMD物料焊接到PCB過程中 SMD物料會(huì)接觸到超過200 C的高溫 高溫回流時(shí) 濕氣迅速膨脹 材料配合不當(dāng)以及材料表面降級(jí)會(huì)使SMD物料斷裂和分層 MSD控制指對(duì)不同潮濕等級(jí)的MSD物料的搬運(yùn) 包裝 運(yùn)輸和使用進(jìn)行標(biāo)準(zhǔn)方法控制 以免物料受潮而高溫回流導(dǎo)致優(yōu)率及可靠性下降 ProceduresSitesarerequiredtoconformtothespecificationsofJ STD 033AandbeawareoftheinformationcontainedinJ STD 020C CELESTICA ThefollowingproceduresaredescribedinthisdocumentandrepresentthebasicprocessesthatshallbemaintainedandcontrolledforMSD s 1 ReceivingInspection2 Storage CelesticaAsia GenericIntroduction 3 postExposuretoFactoryAmbient4 BoardRework5 Reuseofmaterial6 AuditRequirementsReferenceDocofCELESTICAJ STD 033A AjointstandarddevelopedbytheJEDECandIPCabouthandling Packing shippingandUseofMoisture ReflowSensitiveSurface 由JEDEC和IPC共同制定的有關(guān)潮濕敏感SMD物料的搬運(yùn) 包裝 運(yùn)輸和使用標(biāo)準(zhǔn)J STD 020 MoistureSensitivityClassificationforNon hermeticSolidStateSurfaceMountDevices 非密封固態(tài)SMD裝置的濕敏性分類 ReferenceDocofCDGCELQ 029 PROC 510HandlingProcedureForDryPackingComponent干燥包裝物料的操作程序CELQ 029 PROC 56ProcedureforICs PCBsandPCBAsMoistureControlandBaking MSD物料 PCB PCBA的焗烤和濕度控制的工序 CelesticaAsia ScopeforMSDIC BGAhandling packing shipping useIC搬運(yùn) 包裝 運(yùn)輸和使用J STD 033AAssemblyprocesses massreflow localizedheating boardrework 高溫回流 局部加熱 PCBA返工 有關(guān)術(shù)語(yǔ)和定義MSD MoistureSensitiveDevices潮濕敏感裝置SMD SurfaceMountDevice表面裝貼裝置 Active Desiccant干燥劑HIC HumidityIndicatorCard濕度指示卡MBB MoistureBarrierBag防潮袋FloorLife允許暴露時(shí)間ShelfLife保存期限MSL MoistureSensitivityLevel潮濕敏感等級(jí)RH relativehumidity相對(duì)濕度相對(duì)濕度是指在特定溫度下空氣中的水氣相對(duì)這個(gè)溫度下空氣所能包含的最大水氣量的比率 用百分比表示 GenericIntroduction CelesticaAsia KeyRequirements ReceivingInspectionPurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification ProcedureComponentsmustbereceivedinthefollowingmanner 1 DrypackedSMDpackagesshouldbeinspectedforabagsealdatelocatedonthecautionorbarcodelabel 2 MBB desiccant HIC MSDLabelshallconformtoJ STD 033A TheMBBshallhaveaMoistureSensitiveIDandMoistureCautionlabelaffixedtotheoutsideortothelowestlevelshippingcontainer Figure1 3 TheHICshouldbereadimmediatelyuponremovalfromtheMBB Ifthe5 RHdotispinkandthe10 RHdotisnotblue theSMDpackageshavebeenexposedtoanexces sivelevel CelesticaAsia FlowchartinCDG KeyRequirements CelesticaAsia Procedure IQC檢查來料 召集ME QA PROD PROG TE MP等部門召開MRB會(huì)議 確定哪些物料可以繼續(xù)再用 哪些物料需要重新Baking 哪些物料必須Reject給供應(yīng)商 可繼續(xù)再用的物料貼上UAI標(biāo)簽 IQC 圖1 HIC超標(biāo)的物料帖上SROT RWK標(biāo)簽 IQC 設(shè)立相應(yīng)的MRR號(hào)并存入MRB 圖2 生產(chǎn)部要Baking的物料貼上SpecialHandling標(biāo)簽 IQC 此標(biāo)簽主要是對(duì)該物料Baking的要求 圖3 生產(chǎn)部Baking完后 貼上一個(gè)焗爐標(biāo)簽 PROD 圖4 2 生產(chǎn)部Baking 開MRB會(huì)議 主要確定的項(xiàng)目 規(guī)則和流程 標(biāo)簽填法 圖片 主要是那些COMP在用干燥箱和焗爐 KeyRequirements 圖1 圖2 圖3 圖4 CelesticaAsia IQC檢查合格后貼上UAI標(biāo)簽 MRB會(huì)議確定必須Reject給供應(yīng)商的物料貼上RTV標(biāo)簽 IQC 并存入MRB內(nèi) 圖5 圖5 CelesticaAsia KeyRequirements StoragePurposeComponentsshallbereceivedinacontrolledenvironmentforTemperatureandHumiditywithproperidentification ProcedureThefollowingproceduresarecoveredonthefollowingpages 1 DryCabinetstorage2 DryPackstorageTable1outlinestheattributesofthedifferentstoragemethods CelesticaAsia Storage DryCabinetPurposeDrycabinetsusedtostorecomponentsshallcontroltheTemperatureandHumidityofthespacewithinconsistently Procedure1 DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection 2 PlacedrycomponentsincabinetmaintainingRHofnomorethan5 RH ComponentsmaybeexposedorsealedinaMBB 3 LogtheDateandTimecomponentisplaceinthecabinetorplaceaMSDcontrollabel tagonthecomponentpackaging 4 Temperaturewithinthecabinetshallbecontrolledto 30 C INCDG 35 85 RH12 27 KeyRequirements CelesticaAsia McDry干燥箱RefDoc CELQ 052 MPI 1907 DongguanMPIDL 1 打開包裝的物料 1 如果在一個(gè)小時(shí)內(nèi)用完 只需真空包裝 2 如果超過暴露時(shí)間用完 就必須重新Baking 3 濕敏水平為2至4的元件 如果暴露時(shí)間不超過12小時(shí) 最少需要暴露時(shí)間的5倍的時(shí)間去干燥 這要求儲(chǔ)存的濕度條件不可高于10 RH 4 濕敏水平為5至5a的元件 如果暴露時(shí)間不超過8小時(shí) 最少需要暴露時(shí)間的10倍的時(shí)間去干燥 這要求儲(chǔ)存的濕度條件不可高于5 RH KeyRequirements RH顯示器 CelesticaAsia CDG的3個(gè)主要濕度控制表 CelesticaAsia KeyRequirements Storage DryPackPurposeDrypackingshallbeperformedconsistentlytocontroltheTemperatureandHumidityWithintheMBB Procedure1 DrycomponentsandpackagingmaterialifnecessaryasdefinedinDryingsection 2 PlacethecomponentsintoaMBB 3 PlacetherequiredamountofdesiccantintotheMBB 4 PlaceaHICintotheMBBwiththecomponents EnsureHICisnotplacedontopofthedesiccant 5 RemoveanyexcessairfromtheMBBbygentlypressingthebagtowardstheopeningasclosetothecomponentsaspossible Usingvacuumpriortosealingisoptional 6 SealtheMBBusingtheheatsealer Sealthebagclosetotheopeningofthebagtoallowspaceforsubsequentsealing VacuumPacker 真空包裝機(jī) RefDoc CELQ 029 MPI 850 DongguanMPIDL 1 7 Inspectsealforanyairleaks 8 PlaceorupdateexistingMSDcontrollabel tagontheMBB 9 Storethedrypackinambientconditions 40 C 90 RH FloorlifeFloorlifearealways24hrsforallcomponentsexceptlevel6 1 2 除Level6 1 2外所有MSD零件的FloorLifeCDG均定為24小時(shí) SMDpackagesclassifiedasLevel6mustbedriedbybaking thenreflowedwithinthetimelimitspecifiedonthelabel Level6用之前必須焗CDGhavenofloorlifelimitforLevel1 2 CDG對(duì)Level 2沒有floorlife限制 CelesticaAsia KeyRequirements Attention1 Moisturesensitiveitemsclassifiedatlevels2athrough5ashouldbepackagedinhermeticallysealedbarriermaterialswithdesiccants ThecomponentsmustbedriedpriortobeingsealedinMBB 2 SMDpackagesclassifiedasLevel6mustbelabeledanddriedbybaking thenreflowedwithinthetime 3 TablebelowdetailsdrypackingrequirementsfordifferentMSLdevices CelesticaAsia KeyRequirements 4 CarriermaterialsthatareplacedintheMBBcanaffectthemoisturelevelwithintheMBB Therefore theeffectofthesematerialsmustbecompensatedforbybakingor addingadditionaldesiccantintheMBB postExposuretoFactoryAmbientIfcomponentsarewithlevel1orlevel2 theexposuretimeisnotaconcern Ifexposurenotgreaterthan1hr floorlifeclockcanstop Ifcomponentsarerebaggedusingtheoriginalpackingmaterialsthisshouldbedonewithin30minutesaccordingtoJ STD 033A Ifexposurenotgreaterthan8hrs aminimumdesiccatingperiodof10XbydrypacktheexposuretimeisrequiredtodrytheSMDpackagesenoughtoresetthefloorlifeclock Ifcomponentswithlevel2aor3exposedforanytimelessthantheirfloorlife thefloorlifeclockcanstopusingdrypack Ifexposuregreaterthan8hrsandlessthanitsfloorlife 24hrs thecomponentsshouldbereflowedpriortothefloorlifeorotherwisemustbere bakedanddrypacked reflowedpriortothefloorlifeorotherwisemustbere bakedanddrypacked 如暴露超過8小時(shí)小于 小時(shí) 須在24小時(shí)里reflow完 否則要Re bake再包裝 Ifexposuremorethanitsfloorlife 24hrs thecomponentsmustbebaked48hrsat125C priortoreflowordrypack 若暴露超過24小時(shí) 則reflow或干包裝前一定要焗 小時(shí) can tbeused 超過儲(chǔ)存期限的物料用之前須檢查 CelesticaAsia KeyRequirements Ifexposuremorethanitsfloorlife 24hrs thecomponentsmustbebaked48hrsat125Cpriortoreflowordrypack BoardReworkIfanycomponenttemperatureexceeds200 C theboardmustbebakeddrypriortoreworkand orcomponentremoval Ifdonotneedtoreusethesuspecteddefectivepartorperformancefailureanalysisthenbakingtheboardisnotrequired BakedurationofPCBAisbasedonthecomponenttoberemoved PCBAreworkflowchart CelesticaAsia KeyRequirements WORKDESCRIPTION IC PCB和PCBA的焗爐指示RefDoc CELQ 029 MPI 1426DongguanMPIDL 11 IC預(yù)焗方法根據(jù)IC的焗爐溫度設(shè)定值 選擇可承受此溫度的導(dǎo)電管或盤 將電子元件平放在導(dǎo)電的管上或盤上進(jìn)行焗爐 焗完的電子元件必須作防潮包裝以備用 2 PCB預(yù)焗方法對(duì)於PCB 將電路板放在層架上 每疊之間及與焗爐內(nèi)壁最小留2吋空間以便疏氣 對(duì)除Matrox產(chǎn)品之外的所有PCB 每疊的高度最大2吋 如沒有足夠的PCB層疊 可把重物壓在電路板上 以避免電路板焗板後拗曲 對(duì)于Matrox產(chǎn)品所有PCB 每疊的高度最大1吋 而且需放置重物壓在電路板上以避免電路板焗板後拗曲 對(duì)于Matrox需要特別Rework的產(chǎn)品 每疊的高度最多是4塊PCB重疊放置 而且需放置重物壓在電路板上以避免電路板焗板後拗曲 焗完的電路板必須於24小時(shí)內(nèi)進(jìn)行回流 否則要作防潮包裝 CelesticaAsia 3 PCBA預(yù)焗方法對(duì)於PCBA 將電路板放在層架上 不可層疊 電路板之間最小留1吋空間以便疏氣 對(duì)於已裝配電路板PCBA 在出烘爐時(shí) 生產(chǎn)部需要在已裝配電路板PCBA的流程卡上邊蓋上 B 印和寫下出爐的日期和時(shí)間 它們一定要在24小時(shí)之內(nèi)進(jìn)行加熱進(jìn)行零件翻修 否則需要再一次烘板 ICs和PCBA的焗爐參數(shù)設(shè)定PCB的焗爐參數(shù)設(shè)定 CelesticaAsia CDGMSDLabel ReuseofmaterialPurposeDryPackingmaterialsmayberecycledorreusedtoreducecosts ProcedureDesiccant HICandMBBcanberecycledaccordingtomanufacturer sinstructions ReuseofDesiccants1 J STD 033ArequiresthatdesiccantsshallmeetMIL D 3464 TYPEII2 Activatedclaytypedesiccantscanbebakedaccordingtomanufacturer srecommendationtorenewittooriginalspecifications 3 Priortoreuse thedesiccantsshouldbebakedfor48hrsat125CalongwiththeMSD s4 Itisrecommendedthatthedesiccantsshouldbereusedonlyforonecycle ReuseofHIC1 J STD 033ArequiresthatHICshallcomplywithMIL 1 8835 Atminimum theHICshallhavethreecolordotswithsensitivityvaluesof5 RH 10 RH 15 RH 2 HICcanbebakedforreuse TheHICcan tbereuseduntil5 RHvaluebecomescompletelyblue CelesticaAsia 3 ItisrecommendedthattheHICbebaked1hrat125Candreusedonlyforonecycle ReuseofMBBMBB smayber