教程詳解文稿

MCOTIPresentationMCOTIPresentationofPottingMaterialsforElectronicsDate:Nov.,MobileMail:Jack@Shanghai,ChinaPartPartI:GeneralPartII:SealantPartIII:ApplicationOther:ElectronicsAssemblyPartPartI:GeneralProfessionalMat’lMcotiexpertMcotisourcePanacol-LordRampfPanasonicProfessionalMat’lMcotiexpertMcotisourcePanacol-LordRampfPanasonicH?nle-StructureSealing,encapsulationand-StressThermalElectronics&(1K,glue&foamNewMedicalWhySealingforWhySealingfor-WidetemperatureHighSaltyHighperformanceandmoreIncreasingpowerPurposeofPurposeofMoreandmoreelectronicsarepottedforhigherAchievehigherIngressProtection-ProtectallcomponentsfromintrusionofwaterundermostWithhigherthermalconductivitytoconductheatwhichgeneratedbykeyelectricalcomponentstothesurfaceofenclosureExtendtheImprovethePassUL94V0ProtectionSchematicpresentingthemajorelectronicmoduleenvironmentalprotectionapproachesbyliquidpolymer1.Partialcircuit2.CompleteProtectionSchematicpresentingthemajorelectronicmoduleenvironmentalprotectionapproachesbyliquidpolymer1.Partialcircuit2.Complete4.CompleteElectronicsEnvironmentalProtectionStrategies:Benefit/RiskNoLowestParticulate,gas,ElectronicsEnvironmentalProtectionStrategies:Benefit/RiskNoLowestParticulate,gas,UsuallyforbenignProtectivecoating/sealingmaterialmaybechangedrapidly.ProcessusuallyIncreasingtheFormediumSometimecanbeusedincombinationwithsealingorotherprotectionstrategiesforharshenvironmentProtectivecoating/sealingmaterialmaybechangedrapidly.ProcessusuallyIncreasingtheFormediumSometimecanbeusedincombinationwithsealingorotherprotectionstrategiesforharshenvironment3.PartialOverallrobustnessIncreasingtheDevicethermalarrangementmustbeExtentofenvironmentalrobustnessprocessaswellasonmanagementofinternalstresses4.CompleteOverallrobustnessSomeprotectionfromIncreasingtheDevicethermalarrangementmustbeExtentofenvironmentalrobustnessaswellasonmanagementofinternalstresses.AlmostbestprotectionProtectionApproachesfromProtectionApproachesfromFlexible(UVcuring(UVcuringFlexible(UVcuring(UVcuring(gelandFlexible(UVcuring(UVcuringPartPartII:SealantSiliconechemicalPDMSformostcommonpolymerforlowtemperatureflexibilitySiliconechemicalPDMSformostcommonpolymerforlowtemperatureflexibilityTrifluoropropylsiloxanepolymerforgreatswellingPolyurethanesynthesis,whereintheurethanegroups—NH-(C=O)-O-linkthemolecularunits.EpoxychemicalflexibleandUVepoxyBisphenolAformostCharacteristicsofVariousMost-50Cto+-40Cto+-50Cto+CharacteristicsofVariousMost-50Cto+-40Cto+-50Cto+Curingtypes_HeatwithelevatedCuringtypes_Heatwithelevated(125to150OximeandCuringtypes_R.T.curingorelevatedCuringtypes_R.T.curingorelevatedUVProductsAttributesfor1K/2K(1or2CureTemp(RTorRoomRigidSemi-rigidProductsAttributesfor1K/2K(1or2CureTemp(RTorRoomRigidSemi-rigid(D60-Elastomeric(A60-GelYes(uptoYes(uptoYes(uptoFlame105,130,105,GoodGoodGoodPartPartIII:ApplicationsApplicationOtherPottingApplicationOtherPottingandencapsulatingElectronicignitionandenginecontrolRidelevelandwheelspeedsensorsLightingballastsandHIDCapacitors,switches,CircuitLidBatteryRadioPottingandencapsulatingLEDDC/DCHIDLightingballastsandHIDCablePottingandencapsulatingSensorApplicationforInverterMCOTIprovideApplicationforInverterMCOTIprovidesolutionswithhighcostperformanceforInverterSiliconePottingSolution:SC-305&SCThermalInterfacialMaterial:SiliconefreegreaseKP12,TapeKLPUPottingforhigheringressprotectionlevel:PUsealantPUR21-PUSealingforgoodwaterproofIP76:PUgasketPUR32-SolarInverterPottingSolarInverterPotting----------Goodflowability:5500cPEasyhandling:1:1mixingratioRoomtemperaturecureLowHighthermalconductivity:0.7W/mKGoodelectricalpropertiesRoHSandUL94-V0AlsosuitableforhighpowerLEDandHIDlightingSolarInverterPottingSolarInverterPotting2-CPU/RAKU-PUR21------------混合比例100:16重量比硬度:SHORED40-50高防水級別IP67以上導(dǎo)熱系數(shù):0.76W(m*K)使用溫度:-40到130絕緣強度耐高溫性：RTIRoHSandUL94-:Keratherm?–ThermalconnectionIGBT-InverterSiliconefreethermalKeratherm?–ThermalconnectionIGBT-InverterSiliconefreethermalThesilicone-freethermalcompoundKP12consistsofsynthetic,thermalpolymerandissuitableforafastandeffectiveheatdissipation.Thepasteisparticularlysuitableforsiliconesensitiveapplications.KP30,000FlameLongtermstability(1000h/85°C/85%relativehumidity)Keratherm?–ThermalconnectionCPUs,FlipChips,BGAs,MOSFETSonKeratherm?–ThermalconnectionCPUs,FlipChips,BGAs,MOSFETSonheatCeramicfilleddouble-sideadhesiveForexamplepowersuppliesandinvertertelecommunicationKLFlameRAKU?PUR32-FoamedPU32-32-3250-32-3250-Weightof320-70,000–80,000–50,000–Tack-free2RAKU?PUR32-FoamedPU32-32-3250-32-3250-Weightof320-70,000–80,000–50,000–Tack-free2-7-6-Shore45–Elongationat%130-24h(50%/70oC)%10-0WaterAbsorption(24hstoringin10mdeepwater)%6-99-40to-40to-40toSpecialLowwaterGoodULIPGoodadhesiontoIPGoodadhesiontoVehicleTypicalTemperatureSomeChemical/MechanicalAInterior,nosun–45oC<->VehicleTypicalTemperatureSomeChemical/MechanicalAInterior,nosun–45oC<->B–45oC<->C–45oC<->D–45oC<->Water,fuel,oil,coolant,E–45oC<->Water,fuel,oil,coolant,F–45oC<->G–45oC<->Water,salt,roaddebris,cleaningModuleModuleB,D,E,ModuleModuleB,D,E,Temperature,automotivefluiddust/dirtprotection,vibrationDriverA,D,G,inside-S,HarshDriverA,N,BrakingsystemC,S,Harshenvironment,brakefluid,GS,particulateprotectionFuelsystemGS,Harshenvironment,fuelresistanceEnginecontrol,fuelD,E,F,S,S/C,specificrequirementsProtectionstrategy:N=Notusuallysealed—fluidshedding;S=sealed;C=conformalcoatedcircuit;S/C=sealed/conformalcoated;C/S/V=conformalcoated/sealed/vented;E=encapsulated;U=uncoated.SolutionsSolutionsforLEDDriver/PowerReliabilityrequirementsforLEDdriver/PowerWideoperatingtemperaturefrom-40toStoragetemperaturefrom-40toWaterproofandMoistureresistanceLongerlifetimefor>40,000hrswhichcanmatchwithlifetimeofTemperatureaffecttopowerReliabilityisafunctionoftemperatureandloweringtemperatureincreasesthereliabilityofallcomponentsinthepowersupply.TheincreaseinoperatingtemperatureshortenthelifetimeofthepowerTheincreaseinoperatingtemperaturealsolowertheefficiencyofpowerImprovethelifetimeofpowerPossiblesolutionistoreducetheoperatingtemperatureHighefficiencydesign(reduceheatdissipationinthepowerImprovethermaldesigntotransferanyheatgeneratedfromtoambientMetalLEDDriverModule2-CLEDDriverModule2-CPU/PUR?21-2350--Lowinitialviscosity2800Roomtemperaturecurecanbeacceleratedrapidlywiththepresenceofheating--------Wideworkingtemperature-40to135GoodelectricalpropertiesHighthermalconductivity:0.76W/mKWaterprooflevel:>IP67ExcellentthermalshockHighadhesiontoavarietyofmaterials.RoHSandUL94-V0AlsosuitableforHIDlampballastandautomotiveelectronics2-CPU/UR---Low2-CPU/UR---Lowinitialviscosity750Roomtemperaturecurecanbeacceleratedwiththepresenceofheating-Thecuredelastomerissoft,flexibleandevenhasaverylowmodulusattemperaturesdownto-80oC--ExcellentthermalshockGoodelectrical-Highadhesiontoavarietyof--Lowwaterabsorption<AlsousedforAirflowsensorSulfur-containingmolecularspecies,suchashydrogensulfide(H2S),maydiffusethroughsomesiliconeprotectivecoatingstoreactwithunderlyingconductorandcomponentmetallization,withthepotentialforcausingcomponentfailure.Thesulfurcorrosionshowninrightpicture(top)wascausedbyapartiallyvulcanizedrubbercomponentadjacenttothelowerinstrumentpanel-mountedsilicone-coateddevice.TheinfiltrationofH2SandothersmallmoleculesintoanunderhoodsiliconeFIPG-sealedmodulemayberemediedbythesubstitutionofaflexibleepoxyFIPGmaterial.BenefitfromMcoti’sepoxyPottingforEVPowerIndustry-ElectricalVehiclesBatterychargersPottingforEVPowerIndustry-ElectricalVehiclesBatterychargersPowertransformersAnAmericanEVNissan,GM,Toyota,anyEV-RTI150Cor-Easy1:1mix-customizedggel-Lowviscosity,goodflow.Noair-Gelconsistency,nostresson-Easy1:1mixTC--Greasecanbecuredin-situorbyLORDmaterialsarehighlycustomizabletomatchdesiredprocesscharacteristicsandcontrols.WeprovidematerialsolutionstospecificneedsBatteryChargers:Highvoltagebatterychargersinelectricvehiclesrunhotrequiringgoodthermalpottingcompoundtomanageheat.SC:320iscurrentlyusedtopotEVbatteryPowerInverters:HighpowerdriverthatconvertsDCtoACandpumpspowertocarmotorsLayoutofPowerElectronicsinPowerEVPowerLayoutofPowerElectronicsinPowerEVPowerChargerorPowerGraphicsareonly.TheyareLOCATIONOFSC-320,SC-300M,TC-501PowerBenefitSC-SC-320is45%moreefficientinconductingViscosityBenefitSC-SC-320is45%moreefficientinconductingViscosity@25C,Lowerviscositymeansbetterflow-abilitywhichreducestheriskofairentrapment.ShoreA60(at1:1mixLowerdurometerreducesmechanicalstressonelectroniccomponents,lowertheprobabilityofShoreOO-25toA-Widelatitudeofadjustabledurometertofitspecificphysicaldesignofdevice.Expansion,PPP/oCLowerCTEresultsinlowermismatchofexpansionduetotemperaturechange.Thereforelessmechanicalstress.LORDcollaborateswithuserandtofitprocessshelfproduct.Canbettermatchcustomer’sprocessandproductproduct